Process Mean of Tolerance Settings of CPU Components via CAE Simulation and Response Surface Methodology

Due to the upgrading of industrial technology and the maturity of electronic technology, product development technology, incorporating complex designs, has become highly sophisticated. Computer-aided engineering (CAE) has become a key procedure of high-tech industry. In this paper, CAE was used to simulate heat flow with CAE simulation software on the heat removal of a central processing unit (CPU) of a notebook computer component. A regression model was then obtained by using response surface methodology with the Box-Behnken design experimental matrix and by using different levels of experimental combinations. In addition, the optimal value of mean time between failures (MTBFs) was obtained by using the system response at unit cost as the response value. Finally, optimal settings were found to maximize the MTBF of a CPU.