Process Window Optimization by Die to Database e Beam Inspection - Tuung Luoh

e Beam inspection (EBI) technique is widely used in semiconductor manufacturing, people usually utilize EBI to verify the electrical defects and physical defects. However, the inspection performance is dependent on the operation modes selection and the integrated methodologies of other tools or software. Hot spot inspection gain much better alignment stability during inspection even under small inspection filed due to hot spot mode inspecting the sites with exactly same coordinates in each die. Therefore, it is implemented into Die to database (D2DB) inspection to get high resolution images with accuracy position. D2DB inspection can help us to find out the systematic defects in the huge database and highlight the risk tiny defects automatically. Focus exposure matrix (FEM) window in contact/via holes size or the CD of word/bit lines can be identified directly by die to database technique, which has better capability to verify the size of contacts/vias or CD of lines than that using KLA inspection. Furthermore, the CD variation within shot map can get the excellent correction of across chips and wafer by D2DB inspection technique as device shrink to 30nm and beyond.