Abstract:
This article consists only of a collection of slides from the author's conference presentation. on-die power integrity analysis; capacitor; power impedance measurement; p...Show MoreMetadata
Abstract:
This article consists only of a collection of slides from the author's conference presentation. on-die power integrity analysis; capacitor; power impedance measurement; power decoupling strategy; package-level power integrity analysis; die-package-board codesign methodology; SSO and SSI.
Published in: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)
Date of Conference: 30 July 2018 - 03 August 2018
Date Added to IEEE Xplore: 18 October 2018
ISBN Information:
Contents 