Simulation, Modeling, Manufacturing, and Characterization of a Planar Magnetic Face to Face Integrated Transformer

Nowadays, the miniaturization of the passive components is the major challenge in the better integration of electronic circuits in portable devices. This paper presents the simulation, the modeling, the manufacturing, and the characterization of a face to face transformer where conductors are buried in the magnetic layer and where the transformer's primary and secondary windings are turned in the plane by 45°. The buried conductors allow the inductor magnetizing to be increased by a ratio of 50%. The turn of the transformer's primary and secondary windings allows the capacitance coupling to be decreased by a ratio of 100%. Simulations are made by using the high-frequency structural simulator, which is 3-D finite-element software. Measurements are performed for frequencies ranging from 40 Hz to 300 MHz by an impedance meter and a vector network analyzer. Good consistency between the simulation and measurement is obtained.