Automatic Measurement System for degradation analysis in thin-film AlCu metallizations

In this work a thermal test on multilayered integrated thin-film AlCu resistive structures is performed in order to study physical degradation phenomena involved in thermal treatment of metallization. A complete Automatic Measurement System is designed and realized to acquire resistive and temperature values during all the testing time with the aim to check the degradation process and the reliability performances of the structures under test. The thermostatic oven used for the thermal ageing has been characterized to guarantee specific temperature uniformity and stability.