Effect of rapid inducted heating on the microstructure of solder joint in IC

This experiment mainly study the influence of the thermal fatigue of solder joint, solder was - Cu and Sn, Pb, Sn - Ag is 760 microns in diameter, welding plate of 560 microns. Internationally accepted tin-lead solder is most likely to replace the Sn Ag - Cu alloy series. In order to study the temperature and stress under the dual function of single substrate BGA solder joint in the process of thermal fatigue deformation process, organizational structure evolution, establishing the model of fatigue study solder joint fatigue mechanism; Find out fast cyclic heating and fast cooling the coupling mechanism of solder joint fatigue and solder joint interface evolution process. First of all, experimental apparatus mainly has a high frequency current box, catheter, relay and thermocouple. Under the condition of rapid heating and rapid cooling, the thermal fatigue behavior of single substrate.