Optimization of Gold Wire Bonding Process for Microwave Components by DOE Method

In this paper, the gold wire bonding process of microwave components was studied by design of experimental (DOE) method, and the multiple linear regression equation of the pulling force corresponding with bonding parameters was obtained through the analysis of variance (ANOVA). Results showed that the degree of experimental factors influence on pulling force was as follows: bonding power>bonding temperature>bonding pressure>ultrasonic time>deformation. Additionally, the initial optimized parameter combination was got: the bonding temperature was 130 °C, the bonding pressure was 25 cN, the bonding power was 0.50 W, the ultrasonic time is 60 ms, and the deformation was 60%. The pulling force of wire bonding can be controlled in the range of 10.0 to 10.5 gf by the optimized combination of bonding parameters.