Laser bonding of glass and glass with constant temperature output

The glass and glass laser bonding technology is a laser cladding technology with glass frit as adhesive layer. Due to the thermal expansion coefficient of glass and other factors, the bonding process window is narrow. The uniform temperature field is required for glass laser bonding. The traditional encapsulation used constant power laser is easy to lead to the unevenness of temperature field distribution and affect the quality of bonding. Based on bismuth salts glass slurry, the encapsulation method combining low temperature laser scanning and high temperature laser scanning is proposed under the constant temperature output. Compared the glass encapsulation effect under different output temperature of the laser technology, the process of laser bonding is optimized. The sample with no crack on the surface of the laser bonding has achieved. At the same time, the water vapor transmission rate (WVTR) of encapsulation structure is 2.0875 × 10
^-5
g/m
²
·day with the electrical Ca test.