Study of the fabrication and organization properties of copper-based Ba1−xSrxTiO3 composites

Barium strontium titanate ceramic particles which have negative thermal expansion properties when it reaches the Curie temperature are choosen as the reinforcement and copper which have high thermal conductivity are choosen as matrix of composites. Different content of strontium in barium strontium titanate ceramic particles reinforced copper matrix composites are prepared by Spark Plasma Sintering for electronic packaging applications. The methods of microstructure analysis are employed to observe the morphology of reinforcement and matrix in composites, and interfacial characteristics. Thermal expansion instrument and thermal conductivity equipment are used to test and analyze the thermal expansion and thermal conductive ability of the composites. And the conductivity of the composites is tested by intelligent resistance tester.