Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material

Because its low sintering temperature, high melting point, excellent mechanical reliability, high electrical and thermal conductivities, silver nanoparticle sintering has the potential to be applied in high power electronic packaging as an alternative lead-free chip attach material. In this paper, IGBT simulation model of the double-sided cooling package is built, and the different chip attach materials of traditional Sn/Ag materials and silver nanoparticle sintering materials are compared. ANSYS is applied to simulate and analyze thermal distribution of the model. Results show that the IGBT module which adopts silver nanoparticle sintering material in the same boundary conditions, and the maximum chip temperature of the module is 77.1907 °C, 14.14% lower than the traditional Sn/Ag material. This analysis can be further applied that the thermal properties of Silver nanoparticle sintering materials are better than that of traditional Sn/Ag materials.