Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package

The novel reactive adhesive tape with high thermally conductive and good creep resistance was prepared though mixing modified polyacrylate, epoxy, latent curing agent and alumina filler followed. The curing behavior, adhesive properties, thermal conductivity, thermal properties and cross-section structures of the obtained materials were investigated by DSC, UMTM, TPMBE, TGA and SEM, respectively. The calendering method has the dual characteristics of the initial adhesive force of the pressure-sensitive adhesive and the epoxy adhesive reaction type and thus has a strong shear strength. The results show that the shear strength of the epoxy modified tape exceeds 30 MPa, indicating that it has excellent adhesive properties. curing temperature at 160°C can be achieved by the addition of latent curing accelerators, and the solidified organic material has a decomposition temperature higher than 300°C, indicating that it has excellent heat stability. In addition, thermal conductive tapes prepared can achieve higher thermal conductivities up to 2.02 (W/ (m·K)), mainly because of the tighter contact between the thermally conductive fillers during the extrusion process.