An effective way to solve the void problem of traditional underfill based on NCP technology

High I/O density, short interconnect lines, self-aligned mounting, good heat dissipation, and small assembly area make flip chip packaging become one of the most attractive technologies for contemporary electronic packaging. As the chip size increases, the gap between the chip and the substrate and the pitch of the solder connection point decrease, non-uniform voids will be produced in the conventional flip chip underfilling process. In this study, the problem of high-density flip-chip underfilling is studied. NCP thermocompression bonding is used to solve the void problem that occurs in the traditional under-filling process. Voids in the underfilling process can be effectively eliminated by optimizing the process condition for NCP thermocompression bonding.