A novel graphene oxide millispheres / epoxy resin composite with improved thermal conductivity

In order to protect electronic equipments from thermal damage and improve their reliability, longevity and performance, high thermal conductivity polymer composites have attracted widespread attention in recent years. However, traditional polymer composites typically have a low thermal conductivity, hardly satisfying the continuous demand for high-performance thermal-management materials. In addition, the preparation process of traditional composites is usually complex. Herein, we report on a novel method for preparing graphene oxide millisphere, and composites made of these graphene oxide millispheres, which have a maximum out-of-plane thermal conductivity of 1.179 W m
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1K
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and high thermal conductivity increasing rate of 39% to 111%. The graphene oxide millispheres in the composites can form highly ordered three-dimensional heat conduction structure in the matrix, which effectively reduces the interface thermal resistance and improves the thermal conductivity of the composite. These results indicate that the composite material can be well applied in the field of advanced electronic packaging, and this experiment opens up a new path for further research on polymer composite materials with high thermal conductivity.