Molecular dynamics study of copper wire bonding process

The function of integrated circuit (IC) packaging is to supply power path, signal path, heat dissipation path, mechanical support and environmental protection for a chip. Bonding wires are the bridges between the chip pads and the inner leads of leadframe. So the bonding quality directly affects the electrical performance of a packaging, it is necessary to understand the wire bonding process in depth. In this paper, the molecular dynamics method is used to study the microstructure evolution of Cu/Al bonding interface for copper wire bonding.