Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding Method

The temporary assembly of Glass and polystyrene (PS) substrates, regarding organic-inorganic hybrid structures, enable new opportunities for realizing flexible devices based on thin-film transistors (TFTs). In this paper, we report a new method for bonding of glass and polystyrene substrates with vacuum ultraviolet-ozone (VUV/O3) surface treatment without employing heat as well as debonding with high-low temperature circle in the fabrication procedure of display process. The integrated area of bonding pairs were measured to be >75% after keeping in storage at room temperature (~25
^o
C) about 24 h, which represents a superior strength. Moreover, with nearly no flaw bonding interface the polystyrene-glass bonding pair performs superb optical transparency. Detailed properties characterization of bonding interfaces and VUV/O3 treated surfaces were implemented and analyzed. In debonding part, with a view to the thermal expansion discrepancy between two substrates we successfully separate glass and polystyrene substrates after high-low thermal circle (100-0
^o
C). This feasible technique to achieve effective bonding and debonding of glass and polystyrene substrates in fabrication process for display devices.