Investigating Active Shielding Method for Reducing the Crosstalk Effects in Copper and MWCNT Bundle Interconnects in Ternary Logic

In this paper, we investigate the effectiveness of active shielded copper and MWCNT bundle interconnects to eliminate the crosstalk induced functional failure in ternary systems. This study is done for the intermediate and global level interconnects at 22 and 14 nm technologies. The results indicate that the copper interconnects, even with the Shield lines, are not able to eliminate the crosstalk-induced functional failures in ternary logic systems while active shielded MWCNT bundle interconnects is able to omit the crosstalk induced functional failure for interconnects in global and intermediate level at the technologies under investigation. The average worst-case crosstalk noise peak in ternary logic using active shielded MWCNT bundle interconnects is reduced by 33% and 40% for the intermediate interconnects at 22nm and 14nm technologies and 37% and 42% for global level interconnects at 22nm and 14nm technology nodes compared to their Cu counterparts. In addition, active shielded MWCNT bundle interconnects have lower crosstalk delay for long wires compared to active shielded copper interconnects.