Impact of Wire RC Based on High Voltage SCAN Failure Analysis in 10nm Process

SCAN failure analysis that occurred only in the high voltage region was analyzed through in-circuit probing using laser voltage probing (LVP) technique in 10nm process. LVP results provided that high wire resistance of 4th metal layer had lead hold violation between launch and capture clock paths. This implies the importance of Back-End-Of-Line (BEOL) information that is monitored in mass production and design phase in high scaled process.