Effective Package FA procedures on Flip Chip Ball Grid Array (FCBGA) Package with Copper Pillar (CuP) bumps

Overcoming challenges not only in the design and assembly manufacturing but also in the physical failure analysis of flip-chip BGA packages with Cu pillar (CuP) bumps is of outmost importance especially with the increasing utilization of this package type in various market segments including the rapidly evolving consumer and mobile market. In this paper, we present innovative and effective methodologies for physical failure analysis on flip chip ball grid array (FCBGA) package with Copper (Cu) pillar bumps. The procedure that will be discussed does not require new failure analysis equipment but rather a reuse and extension of existing equipment used on standard wire-bond packages. Case studies to demonstrate the usefulness of the methodologies will also be presented.