Optimization of Soldering Process to Reduce Contamination and Related Consequences

This paper deals with soldering profile optimization and with its impacts on the quality of the soldered joint. Properly adjusted soldering profile directly affects the PCB contamination level by flux residues. The experimental part of this article is focused on reducing the amount of ionic contamination on the PCB by means of a suitable setting of the soldering process. The profiles have been set according to the manufacturer's recommendations. The optimization of the soldering profile has been assessed with regard to the ionic contamination of PCB. Optimized soldering profile, however, affects other solder joints parameters that have an immediate effect on reliability. The consequences of profile optimization is verified by the wetting angle measurement, the intermetallic compound thickness measurement and the amount of voids contained in the solder joint. The paper includes a discussion of the measured results and an overall impact assessment of the profile optimization.