Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last

More and more fan-out packages were implemented in various electron products in recent years. This paper introduces a new fan out wafer level package-M-series. At first, the advantage of M-series is introduced comparing to the traditional fan-out wafer level packages. Further to analyze the electrical performance between M-series, eWLB and FOCLP. Because of characteristics of small package size and the thinnest IC package thickness, fan-out technology is usually used for mobile and IoT application, especially for PMIC or RF devices. For design for PMIC devices, the DC resistance of the package design is always analyzed which is directly relative to IR-drop performance. As design for RF devices, insertion loss and return loss are analyzed, as well as coupling between the chip and the package. Finally, the design lauout suggestion for fan-out package is also discussed in this paper.