A Study of Crystal Orientation of Solder TSVs

We propose combined solder-TSVs and microbumps for cost reduction of 3-D integration. In this study, we find that crystal orientation of solder TSVs are oriented in the same direction by EBSD and TSVs are filled with single solder grain, i.e. grain boundaries are not observed at TSVs. We investigate the dependence of the cooling rate.