Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up

Thin substrate handling has become one of the cornerstone technologies that enabled the development of 3D stacked ICs over the past years. Temporary wafer bonding has continuously improved and reached the maturity level required by volume manufacturing of first generation devices. Yet the need for further development and performance increases remains. Indeed, the continuous push for denser interconnects has brought new requirements for a through-silicon-via technology on one side but also pushed temporary adhesive and carrier technology into the space of wafer reconstruction and fan-out WLP.