3D Heterogeneous Integration with Multiple Stacking Fan-Out Package

Heterogeneous integration with advanced packaging has recently been the subject of intensive discussion and development to pursue optimum electronic system performance. The concept of miniaturized systems is particularly important for applications such as wearable and portable devices, as demands for more integrated functionality, better performance and smaller form factors persist. In this paper, we reveal a new multilayer 3D fan-out stacking integration approach and an ultra-thin 6-layer stacked fan-out package with low warpage. Compared to typical 3D IC stacking with TSV, the new structure exhibits both vertical and lateral integration flexibility. This new 3D fan-out stacking scheme inherits the thermal dissipation benefits from fanout packages with reduced thermal cross-talk and therefore offers a powerful solution for highly heterogeneous and complex systems.