Design and Performance of π-Type Thin-Film Nano/Micro-TEG Using Vacuum/SiO2-Hybrid Insulation Module Structure

xA thin-film micro/nano-TEG (μ/nTEG) using a new vacuum/insulator hybrid thermal-isolation module structure is computationally investigated for wearable device applications. The module has a more easy-to-fabricate structure than the corresponding vacuum thermal-isolation module that gives the performance limit of the μ/nTEG. Nevertheless, it can exhibit high output power comparable to the vacuum thermal-isolation module. A design methodology using a single parameter that can represent the trade-off relation between thermal and electrical resistances is adapted for the proposed module. The optimized design shows a high performance suitable for wearable device applications.