A Development of Resin Insulating Material for High Reliable Enhanced Power Module

The race to develop next generation power module has been intensified. The design of power module should be not only applying much high power density but also the well-considered thermal management of its structure, while expanding its coverage to energy harvesting, industrial robot and automotive application. This paper proposes several key organic insulating materials namely, Resin insulated high heat dissipation substrate, High heat resistance encapsultant for case module, High heat resistant coating material in order to satisfy these requirements. The feasibility of this packaging concept shown better performance compare to conventional module design. Applied much higher current, excellent heat dissipating, superior mechanical reliability and simple module structure.