Impact of Load Profiles on Power Module Design - a Detailed Analysis Based on 7th Generation of IGBT and Diode Technology

With focus on drives applications, the interaction between operating conditions and power module performance is analyzed. For different current and overload levels, the effect on junction temperature and temperature ripple is highlighted, and the impact of the heat sink design on the power module performance is derived. Based on an exemplarily chosen system, the interaction between heat sink and thermal stress is described, and the potential advantages of a temporary operation at elevated junction temperatures, e.g. 175deg C, are presented. Finally, these results are applied to typical inverter designs, where one system has to support different load profiles.