Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles has shown that copper-core PCBs can be automatically assembled and provide high-frequency systems that show adequate reliability during thermal cycling. A single 60-GHz transmitter front end, designed to drive a single element of a phased array, with a 2-GHz bandwidth signal, composed of four GaAs dies, including a phase shifter, integrated onto a copper-core PCB produces an output power of -4 dBm and maintains an on-chip temperature under 51 °C.