Handling of glass and ceramic ultrathin substrates for flexible thin film batteries

This paper reports a novel handling technique based on the use of structurally stuffed-thin sheet as a substrate for flexible and high temperature-fabricated devices. In the presented method, the ultrathin substrate is bonded to an adapted frame using adhesive material compatible with high temperature budgets (>600°C). This concept is evaluated through the realization of solid ultrathin-film batteries TFB (<;20μm) on ultrathin ceramic (<;40μm) and on ultrathin glass stiffened with titanium metal frame and rigid glass frame, respectively. The stack of TFB is obtained using sequential physical vapor deposition (PVD) technique at temperature values up to 600°C. The electrochemical properties of the realized TFBs demonstrate that the approach of this work provides a method for temperature-fabricated devices on ultrathin substrates.