Experimental study of through glass via effects on high frequency electrical characteristics

We study the influence of high frequency characteristics of the through glass via (TGV) and the transmission line on glass for high frequency bands. We designed an evaluation pattern combining a transmission line with some length and TGV, and we formed the test pattern with semi-additive plating (SAP) process. Line design rule defined by electro-magnetic simulation analysis, and we devised measurement pad design to minimize the influence of impedance mismatch on measurement pad location. Through this evaluation, we demonstrated electrical performance of coplanar waveguides (CPWs) with TGV on glass. Insertion loss increasing caused by TGV was about 0.2dB at 30GHz on CPWs. As the result, we considered that the line with TGV can be applicable to high frequency bands.