High speed vertical interconnect analysis for dense pin assignment optimization using electromagnetic multiple scattering techniques

A pin assignment evaluation scheme based on electromagnetic multiple scattering techniques is proposed for massive highly-dense vertical interconnects in advanced electronic packaging. As the method fully captures the multi-scattering and multi-coupling effects among the cylindrical pins, also called vias, a good characterization of their high-frequency electrical behaviors is obtained up to 100 GHz. The colorful ball-map hot-spot of integrated crosstalk and noise power-sum are presented for design visual aids. Using this evaluation algorithm, the pin assignment of a large package (>70×70 mm) with blocks of cores and input/outputs (>3000 pins) can be accurately simulated and efficiently optimized in a few minutes of CPU computation.