SiP module warpage characterization and simulation study

Warpage is one big challenge during manufacturing process for advanced packaging, which needs to be addressed for successful process integration. For these challenges, iNEMI has initiated System-in-Package module warpage project which is to understand the warpage behavior characteristics. This paper presents a comprehensive study on the performance of SiP module warpage with various components geometries with different components densities mounted on substrate, components gap and clearance, and various types of mold compound through experiments and statistical data analysis. In order to understand the behavior of warpage, the simulation tool which considers of the chemical shrinkage is verifying with the experimental data. From this study, we provide the basic design rules based on warpage experiment and simulation.