SiP module mold flowability experiment result and simulation study

SiP turns to be complex due to increasing the number of components in a given space, narrow gap between die-to-passive or passive-to-passive and narrow clearance between mold top to components. Therefore, molding process becomes a critical process to have better reliability due to complex topography to minimize incomplete filling, air trap due to unbalanced flow during the process and solder extrusion or bump bridge due to voiding between solder interconnection. For these challenges, iNEMI has initiated SiP Module Moldability project which is to understand the filling characteristics for several different SiP module designs with 4 types of mold resin systems. This paper presents the outcome from a comprehensive study on the performance of SiP module moldability with various components geometries (different components densities on substrate, component gap & clearance) and 4 different mold resins through simulation and experiments. This study resulted in that all 9 different SiP modules could molded without any significant failures such as incomplete filling issues for different type of 4 mold resins. This is verified by not only from the experiment but also simulation result that no strong correlation between SiP module designs over mold resin systems for moldability performance.