Mechanical characterization comparison as flip-chip package to fan-out package

In this study, the mechanical responses including warpage and die stress were compared between different packages, naming flip-chip, core-less flip-chip, core-less molded flip-chip, fan-out, exposed-die fan-out, and back-side protective fan-out. All packages had the same die size with 8×8 mm
²
, the same package size with 15×15 mm
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, and the same Cu layers with 4L. The finite element method (FEM) was conducted to simulate the warpage and the stress intensity factor (SIF) of the die. The strategy of this study was to compare the mechanical responses of each package, and to show the warpage and SIF ratios. Then the improvements of mechanical responses by changing component thicknesses were compared. Finally, the improvement suggestions were provided.