Development of a thermal cooling model for complex system design using thermoelectric Peltier

This paper presents the development of a thermal cooling model using thermoelectric (TEC) Peltier for complex system design, this complex design contains 576 ASICs dissipating ~ 600 mW each. The model is based on two digital techniques: the computational fluid dynamics (CFD) and the heat transfer analysis (HTA). The CFD technique considers the strength of the specific heat flow mechanism around the area where are located the ASICs to perform the heat transfer analysis using its physical properties. The temperature distribution on the chip surface of each ASIC is used for predicting the heat flow to be evacuated by thermoelectric. Two analyses have been conducted: No convection (without thermoelectric) and forced convection (with thermoelectric) on the system model in COMSOL tool. The forced convection with thermoelectric is the best way to reduce the temperature at 303 °K and to be a good candidate to lower and stabilize the temperature in complex system.