Colloidal silica: Chemistry, properties and adaptations for electronic polishing applications

Colloidal silica products are stable dispersions of non-agglomerated, amorphous, nanometer-size, and spherical particles of silica. The good stability, adjustable particle size distribution and mechanical properties have made colloidal silica a preferred abrasive for many CMP applications. Recently, research and analytical efforts have focused on the development of colloidal products with tunable physical and chemical properties to open up new opportunities in the CMP industry segment.