Building block multi-chip systems using inductive coupling through chip interface

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.