3D printed ceramic structures based on LTCC: Materials, processes and characterizations

3D Multi Material (3D
^mm
) printing of LTCC materials in combination with functional metallic inks based on powder bed structuring is a new and innovative technology which enables the fabrication of electronic components and upcoming circuits, cost efficiently in small series, offer rapid prototyping capabilities as well as will feature less geometrical restrictions during design process compared to other common technologies soon. Recent material compositions of the ceramic powder mixture, binder and functional ink were developed and utilized successfully using an experimental 3D printer. Characterizations of 3D printed ceramic compounds and functional inks exhibit adequate physical and electrical properties. Furthermore, the material powder composition facilitates compatibility to SMT (surface mounting technology) and to common packaging technologies applying a screen printing step which enhance additional functionality of 3D printed electronic devices.