Thermal resistor and capacitor parameter identification using cooling curve of IGBT module

In [1], we proposed a method for identifying the Cauer type thermal parameters based on the junction temperature's cooling curve of IGBT module during shutoff period. This paper utilized the identification method in [1] to realize condition monitoring. Experimental tests are performed to validate the feasibility and accuracy of this approach. Results indicate that the identified RC parameters can be used for monitoring the thermal aging of power device.