Surface mount package for high frequency band

The ultimate goal for cost effective millimeterwave MMIC packages is to provide miniature, lightweight surface mountable solutions. This paper describes the design technologies of a novel approach, where the via holes were optimized through the multilayer ceramic structure. The results of this research, produced a package, RF-VIA Package, with an insertion loss of about 1 dB at 32 GHz (the measurement includes transitions through two substrates, one feedthrough and through one gold ribbon bond) has been accomplished.