Microwire-CMOS integration of mm-scale neural probes for chronic local field potential recording

This paper proposes a novel method for integrating CMOS microelectronics with microwire-based electrodes for next generation implantable brain machine interfaces. There is strong evidence to suggest that microwire-based electrodes outperform micromachined and polymer-based electrodes in terms of signal integrity and chronic viability. Furthermore, it has been shown that the recording of Local Field Potentials (LFPs) is more robust to tissue damage and scar tissue growth when compared to action potentials. This work therefore investigates the suitability of microwire electrodes for LFP recording by studying the electrical properties of key materials. We identify Niobium (Nb) as a candidate material with highly desirable properties. There is however also an inherent incompatibility when it comes to connection of microwire-based electrodes to silicon chips. Here we present a new process flow utilising a recessed glass substrate for mechanical support, silicon interposer for interconnection, and electroplating for contact adhesion. Furthermore, the proposed structure lends itself to hermetic encapsulation towards gas cavity based micropackages.