BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications

In this paper, a 200 mm wafer level integration of microfluidics together with a high performance SiGe BiCMOS process is presented. Using high throughput 200 mm wafer level semiconductor processing steps and wafer bonding techniques, Lab-on-Chip (LoC) systems with combination of Si microfluidics and BiCMOS electronics are realized. A low temperature fusion bonding at 300degC and an adhesive bonding are applied to integrate these technologies together. Based on the BiCMOS microfluidic integration technique, the electrical and microfluidic interfaces are separated from each other enabling highly miniaturized LoC systems. This developed technology helps to reduce the costs and increase the sensitivity which satisfy the needs of LoC systems.