Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations

Due to the advancement of electric mobility in recent years, the need for reliable power electronics has risen exponentially. To enable a proper lifetime assessment of modern high power electronics finite element analysis (FEA) is widely used in industry. Power electronics are available in a variety of types. Within the scope of this work devices with epoxy mold compound (EMC) encapsulations, such as D2PAK technology, will be investigated. In most published simulation approaches on electronic parts they are considered to be in a stress-free state before external load application. However, due to material history induced by manufacturing, these parts may already inherit residual stresses. The aim of the presented work is to properly define residual stresses of EMC encapsulated devices after manufacturing and the implementation in a simulation software environment.