Wafer-Level packaging technology for optical sensor devices

Many optical sensors require a packaging that admits light from a defined range of angles, and blocks light from any unwanted sources (e.g., stray light from screen backlighting). To have a narrow angle range on the sensor (filter), but a wide detection range, a preferred solution is to have an aperture and diffuser integrated into the package. In this work, a film-assisted molding process is developed to produce the desired optical packages (including aperture and optional diffuser) for optical sensors on wafer-level. The wafer-level economics would mean that the resulting packages are very small and cheap.