Hybrid micro-fluid heat sink for high power dissipation of liquid-cooled data centre

Liquid cooling is an attractive and effective solution to handle the increasingly high level of heat density in the advanced data center. A hybrid micro-fluid heat sink including micro-jet slot array, micro-pin fin array and drainage microtrenches, has been designed and analyzed for processor thermal management in liquid-cooled data center. High cooling capability has been obtained with low pumping energy. Thermal resistance of 0.13°Ccm
²
/W is obtained with flow rate 500mL/min and pressure drop 0.8kPa. By increasing flow rate to 1L/min, thermal resistance can be highly reduced. The designed heat sink is able to save cooling energy cost while maintaining high heat removal for data center.