Electromagnetic simulation of bonding wires and comparison with wide band measurements

Several typical bonding wire configurations have been measured in a frequency range up to 20 GHz using a vector network analyzer. Based on scanning electron microscope (SEM) pictures all bonding wires have been discretized and orthogonal grids suitable for electromagnetic simulation have been generated. Full wave finite difference time domain (FDTD) simulations as well as static and quasi static inductance extraction using a new Monte Carlo technique and FastHenry as well as capacitance extraction with a finite element method have been carried out. Numerical results are compared to measured scattering parameters and their quality and frequency dependence is discussed. All simulation techniques are evaluated with respect to their computational effort.