Research of Fan-Out Panel Level Package (FOPLP) manufacturing process using single-sided adhesive tape

Fan-Out Panel Level Package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor, large-area processability and manufacturing cost. However, they typically require us many unique and novel equipment and thus enormous initial cost tremendously. Here we report new FOPLP manufacturing processes involving single-sided adhesive tapes. We investigated that the warpage of molded package panel, called “panel warpage”, will be critically affected by an internal residual stress in the panel which depends on several parameters of the adhesive tapes such as tape thickness and thermomechanical properties of the molding material.