In situ measurement and micromachining of glass

Glass substrates were micromachined using electro chemical discharge machining. The developed tool holder allows to scan the substrate surface as well as machining it in a closed loop. The developed control algorithm for drilling holes allows to achieve relatively high machining speeds (up to 30 /spl mu/m/s) and deep structures (up to 1 mm). Micro-channels up to a depth of 100 /spl mu/m were machined in one step with a removal rate of 4.5/spl middot/10/sup 5/ /spl mu/m/sup 3//s. Reported are some examples of machining micro-holes, micro-channels and modification of existing pattering.