Ceramics for the Future: Advanced Millimeter-Wave Multilayer Multichip Module Integration and Packaging

The advantages of higher-frequency operation, such as wider bandwidth and finer spatial and temporal resolution, have led to increased interest in the use of millimeter-waves (mmWs) in both commercial and military applications-covering, in particular, areas ranging from high-speed wireless communication (including wireless local area networking, wireless gigabit communication, sensor networks, and fifthgeneration systems) to space science to security [1]-[5]. For biological and health applications, mmW imaging offers a superior, safer, and lower-cost alternative to conventional techniques [6], [7].