Optimization of surface component mounting on the printed circuit board using SOM-TSP method

We propose the application of self organising maps-travelling salesman problem (SOM-TSP) method in optimizing the efficiency of surface mounting of electronic parts on the printed circuit board. From the numerical experiment, it was found that the required time for mounting electronic parts can be decreased by our proposed method compared to the built-in method on the mounting-system. As a result, the production output can also be increased using the proposed method.