Dynamic Electro-Magnetic-Thermal Modeling of MMC-Based DC–DC Converter for Real-Time Simulation of MTDC Grid

The model of a modular multilevel converter (MMC) determines the extent of critical circuit information that electromagnetic transient simulations can reveal. In this paper, two MMC models are proposed for efficient real-time hardware-in-the-loop (HIL) emulation on the field-programmable-gate-arrays (FPGA). The nonlinear switch-based model employing the insulated-gate bipolar transistor (IGBT) dynamic curve-fitting model considers factors affecting its transient performance so that device-level behavior such as power loss and junction temperature can be reproduced accurately in the electro-magnetic-thermal simulation of a power converter for its design evaluation. Meanwhile, regarding the MMC submodule as a transmission line stub achieves faster computation speed and enables the formation of a hybrid arm to save FPGA hardware resources. As the large network that the MMC presents is burdensome for real-time execution with a small time-step, circuit simplification based on partitioning and merging is conducted. Hardware implementation of a three-terminal high-voltage direct-current system containing an MMC-based dc-dc converter is carried out and the efficacy of proposed models is validated by comparing HIL emulation results with the offline simulation tool PSCAD/EMTDC.